??Ibuonline Eight tips to share high-frequency PCB design
??custom pcb manufacturer ?High frequency PCB design techniques and methods are as follows:
??1) corner of the transmission line to the 45 ° angle, in order to reduce the return loss
??2) using the the insulation constant value is strictly controlled according to the level of high performance insulating circuit board. This method is conducive to the effective management of the electromagnetic field in the insulating material between adjacent wiring. circuit board manufacturing companies http://www.ib...ring-Services
??3) To improve the high-precision etched PCB design specifications. To consider requiring the linewidth total error / -0.0007 inch cut wiring shape under (undercut) and cross-sectional management and the specified wiring sidewall plating conditions. Solve microwave frequency related to the skin effect problems and implement these specifications is very important for overall management of the wiring (wire) geometry and the surface of the coating.
??4) prominent lead tapped inductor, to avoid the use of leaded components. High frequency environment, it is best to use surface mount components.
??5) To avoid signal vias used in sensitive board the hole processing (pth) process, because the process will lead to the holes generated at the lead inductance.
??6) To provide a rich ground layer. Molded hole linking these ground layer to prevent the 3-dimensional electromagnetic fields on the circuit board.
??7) To select a non-electrolytic nickel plating or gold plating process, do not use the the HASL method for electroplating. This plating surface to provide better skin effect for high frequency current. In addition, this high weldable coating desired lead less helps to reduce environmental pollution.
8) solder mask layer prevents the flow of solder paste. However, uncertainty and the unknown nature of the insulating properties due to the thickness, the entire plate surface are covered with the solder resist material will cause a large change of the electromagnetic energy in a microstrip design. Commonly used welding dam (solder dam) for solder mask layer. The electromagnetic field. In this case, we manage the microstrip to the coaxial cable between the converter. In the coaxial cable in the ground layer is interwoven ring, and evenly spaced. In the microstrip, the ground layer under the active line. This introduces some of the edge effect, the need to understand, predict, and taken into consideration at design time. Of course, this does not match will result in the return loss, and m??Ibuonline share eight skills design of high frequency PCB
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