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Cars > tingyuya’s Garage > Blog > The PCBs & Manufacturing Services board to protect "soft package"

 

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tingyuya

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Abernant, Alabama
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The PCBs & Manufacturing Services board to protect "soft package"

By tingyuya

The PCBs & Manufacturing Services board to protect "soft package"

The PCBs & Manufacturing Services board to protect "soft package"

IT field has become a fashion in DIY. Popular electronics enthusiasts for the shortcomings more "hard package" status quo, the China Association of epoxy resin industry specialist Weapon: circuit board protection available "soft package.

To a circuit board or a smaller board seal to prevent moisture and foreign matter into affect circuit performance, many electronics enthusiasts using wax or asphalt sealant to protect the circuit. In fact, wax and asphalt for the encapsulation material is not good, more disadvantages. "Soft encapsulation" effect to be better, the current common best "soft encapsulation" material has an epoxy resin, and the polysulfide, polyurethane, silicone and other four kinds of packaging materials.
Industrial Machinery

The experts said the so-called "soft package" is that it does not require the use of enclosures and installation and protection of the integrated circuit chip, but by means of organic material printed circuit boards or ceramic metal wiring substrate, the chip is placed directly in a predetermined position, and then the metal wire to each of the output of the chip, an input terminal with the printed lines or metal wiring is connected, and then with a soft encapsulating material covering all the chips, the metal wire as well as individual pads, in order to achieve a chip assembly purposes. "Soft package" In some of the electronic watch circuit, the electronic circuit of the electronic music circuit and amateur production, has been widely applied. Its encapsulation method is very simple and low cost, it is also called a simple package, also known as C • O • B package.

The excellent performance of the insulation resistance, chemical resistance, adhesion, etc. of the epoxy resin encapsulating material, the curing shrinkage rate is low (2%) is optimal in the material of the soft package ". Typical formulations generate the actual glue mixture of epoxy resin and polyamide: 618 (or 828) epoxy resin 100 parts, 650 (or 651) a polyamide of from 50 to 70 parts, EMI-2, diethyl tetramethyl imidazol-2 to 5 parts, 95% Al2O3 ceramic powder (400 mesh) 20 to 40 parts, 5 to 15 parts of silica (# 4), ZnO20 ~ 40 parts TiO25, Cr2O3 (dyes) 1 to 2 parts. First sufficiently stirred, coated on want seal formed in a hemispherical shape (do not get from the bubbles), and then dried at room temperature for 2 to 4 hours, and then at a temperature of 60 to 150 ° C, duration 20 ~ 30min processing Serve. The recipe in the raw material in the chemical shops can purchase complete specialized software package resin on the market for sale (commonly known as vinyl), sub-transparent and opaque two categories, but a few hours the high temperature curing process.

Source:
Material Handling & Construction Machinery

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Cars > tingyuya’s Garage > Blog > The PCBs & Manufacturing Services board to protect "soft package"

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